Title:
PRESSURE SENSITIVE ADHESIVE LAYER-FORMING ORGANOPOLYSILOXANE COMPOSITION, USE OF SAME, AND COMPOSITION DESIGN METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2022/138913
Kind Code:
A1
Abstract:
A pressure sensitive adhesive layer-forming organopolysiloxane composition according to the present invention is characterized by being curable by means of a hydrosilylation reaction, while being also characterized in that: 1% by mass or more of a resin component is (b2) an organopolysiloxane resin that has a weight average molecular weight (Mw) of less than 4,000 in terms of standard polystyrene as determined by GPC using toluene; and the value obtained by dividing a value that is obtained by adding 120 (°C) to the Tg of a pressure sensitive adhesive layer, which is obtained by curing this organopolysiloxane composition, by a value that is obtained by adding 120 (°C) to the Tg' of a composition (a pressure sensitive adhesive layer) obtained by substituting the component (b2) with a resin having a Mw of 4,000 or more, is less than 1.0. If used as a pressure sensitive adhesive layer, the glass transition temperature (Tg) of the pressure sensitive adhesive layer is able to be further decreased in cases where a specific (resin component)/(polymer component) ratio for the achievement of a desired adhesive force is selected; and consequently, the present invention is capable of achieving a strong adhesive force and a low glass transition temperature (Tg) at the same time.
Inventors:
ITOH MAKI (JP)
NAKAMURA AKIHIRO (JP)
SUTO MICHITAKA (JP)
NAKAMURA AKIHIRO (JP)
SUTO MICHITAKA (JP)
Application Number:
PCT/JP2021/048182
Publication Date:
June 30, 2022
Filing Date:
December 24, 2021
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
B32B27/00; C08L83/05; C08L83/06; C08L83/07; C09J7/38; C09J183/05; C09J183/07
Domestic Patent References:
WO2020032285A1 | 2020-02-13 | |||
WO2020032286A1 | 2020-02-13 | |||
WO2020032287A1 | 2020-02-13 | |||
WO2017188308A1 | 2017-11-02 | |||
WO2021029413A1 | 2021-02-18 | |||
WO2021029414A1 | 2021-02-18 |
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