Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2021/145382
Kind Code:
A1
Abstract:
This pressure-sensitive adhesive tape comprises a substrate and a pressure-sensitive adhesive layer disposed on one surface of the substrate. This pressure-sensitive adhesive tape satisfies the relationship Y≤4.5X-22.5, where X (unit: kV) is the thickness-direction breakdown voltage and Y (unit: N/mm) is the initial elastic constant determined from a stress-strain curve obtained by a tensile test. This pressure-sensitive adhesive tape has an excellent balance between insulating properties and windability during winding.
Inventors:
YOSHIMATSU KIMIHIKO (JP)
OTAKE HIRONAO (JP)
OTAKE HIRONAO (JP)
Application Number:
PCT/JP2021/001070
Publication Date:
July 22, 2021
Filing Date:
January 14, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
NITTO INC (US)
NITTO INC (US)
International Classes:
C09J133/00; C09J7/22; C09J7/38; C09J183/00; H02G1/14; H02G1/16
Domestic Patent References:
WO2020017413A1 | 2020-01-23 |
Foreign References:
JP2011032451A | 2011-02-17 | |||
JP2012117054A | 2012-06-21 | |||
JP2001164202A | 2001-06-19 | |||
JPH0264184A | 1990-03-05 | |||
JPH0264186A | 1990-03-05 | |||
CN103484032A | 2014-01-01 | |||
CN105860878A | 2016-08-17 | |||
JP2009024042A | 2009-02-05 | |||
JP2015528837A | 2015-10-01 | |||
JPH08253740A | 1996-10-01 | |||
JP2005298579A | 2005-10-27 | |||
JP2005105212A | 2005-04-21 | |||
JP2003313516A | 2003-11-06 |
Other References:
See also references of EP 4092094A4
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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