Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/068315
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a pressure-sensitive adhesive tape that can have chip components preferably pasted thereto when receiving the chip components, that exhibits excellent detachment performance when re-transferring the chip components, and that can prevent an adhesive from being left on the chip components. A pressure-sensitive adhesive tape according to the present invention has at least one layer of a base material and at least one layer of a pressure sensitive adhesive layer. The pressure sensitive adhesive layer has a shear storage modulus G' of 1 MPa or less at a frequency of 10 Hz at -20°C. The pressure-sensitive adhesive tape exhibits a surface detachment strength of 0.5 MPa or less with respect to SUS in an attachment area of 10 mm × 10 mm.
Inventors:
UCHIDA NORIYUKI (JP)
OGATA YUDAI (JP)
UEDA KOZO (JP)
OGATA YUDAI (JP)
UEDA KOZO (JP)
Application Number:
PCT/JP2022/039020
Publication Date:
April 27, 2023
Filing Date:
October 20, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J7/38; C09J133/06; C09J201/00; H05K13/04
Domestic Patent References:
| WO2022163004A1 | 2022-08-04 |
Foreign References:
| JP2018165293A | 2018-10-25 | |||
| JPH03237181A | 1991-10-23 | |||
| JP2020128533A | 2020-08-27 | |||
| JP6757479B2 | 2020-09-16 | |||
| JP2018536987A | 2018-12-13 |
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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