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Title:
PRESSURE-SENSITIVE ADHESIVE TAPE
Document Type and Number:
WIPO Patent Application WO/2023/068314
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a pressure-sensitive adhesive tape capable of favorably holding a chip component when receiving the chip component, and when re-transferring the chip component, capable of demonstrating excellent peeling performance and prevent adhesive residue from sticking to the chip component. The present invention is a pressure-sensitive adhesive tape comprising a pressure-sensitive adhesive layer that has a ball tack of No. 12 or less and satisfies the ratio t/G' of at least 1, which is the ratio of the thickness t (μm) of the pressure-sensitive adhesive layer to the shear storage modulus G' (kPa) of the pressure-sensitive adhesive layer at 23°C and 1 Hz.

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Inventors:
UCHIDA NORIYUKI (JP)
OGATA YUDAI (JP)
UEDA KOZO (JP)
Application Number:
PCT/JP2022/039017
Publication Date:
April 27, 2023
Filing Date:
October 20, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C09J7/38; C09J133/06; C09J201/00; H05K13/04
Domestic Patent References:
WO2016010013A12016-01-21
WO2022163004A12022-08-04
Foreign References:
JP2011116916A2011-06-16
JP2013159760A2013-08-19
JP2013173913A2013-09-05
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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