Title:
PRESSURE SENSOR CHIP AND PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/080038
Kind Code:
A1
Abstract:
This invention provides a pressure sensor chip that is capable of accurately detecting differential pressure. This pressure sensor chip 20 comprises a third conductive layer 23, a second insulating layer 25, a first conductive layer 21, a first insulating layer 24, and a second conductive layer 22, which are laminated in this order. The first insulating layer 24 comprises opening parts 24B, 24C that are in communication with the outside. The second insulating layer 25 comprises an opening part 25B that is in communication with the opening part 24C and an opening part 25C that is in communication with the opening part 24B. The first conductive layer 21 comprises a first diaphragm 21B and a second diaphragm 21C. The second conductive layer 22 comprises electrodes 22B, 22C. The third conductive layer 23 comprises electrodes 23B, 23C. The first diaphragm 21B and electrode 22B face each other via the opening part 24B. The second diaphragm 21C and electrode 22C face each other via the opening part 24C. The first diaphragm 21B and electrode 23B face each other via the opening part 25B. The second diaphragm 21C and electrode 23C face each other via the opening part 25C.
Inventors:
TSUJI DAIKI (JP)
Application Number:
PCT/JP2021/032694
Publication Date:
April 21, 2022
Filing Date:
September 06, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L13/06; H01L29/84
Domestic Patent References:
| WO2020053485A1 | 2020-03-19 |
Foreign References:
| US20170315008A1 | 2017-11-02 | |||
| JP2010538242A | 2010-12-09 | |||
| JP2001013026A | 2001-01-19 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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