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Patent Searching and Data


Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/137812
Kind Code:
A1
Abstract:
This pressure sensor 10 comprises: a sensor module 11 that has a bottomed cylinder shape, has a pressure receiving chamber C1 therein that is in communication with a flow path, and comprises a diaphragm 11a in contact with the pressure receiving chamber; a pressure detection element 12 that outputs the strain of the diaphragm 11a as pressure; a base ring 14 that is fixed at the outer edge of an open side end part 11c of the sensor module and is disposed on the outer peripheral side of the sensor module 11; a hermetic member 13 that is fixed to the base ring 14 and forms a sealed vacuum chamber C2 that faces the pressure receiving chamber C1 with the diaphragm 11a therebetween; a gasket 18 that is sandwiched between the base ring 14 and a body 5; and a pressing flange 19 that presses the base ring 14 into the body 5 via the gasket 18.

Inventors:
HIDAKA ATSUSHI (JP)
NAKATANI TAKATOSHI (JP)
HIRATA KAORU (JP)
NISHINO KOUJI (JP)
IKEDA NOBUKAZU (JP)
FUKAZAWA MASANORI (JP)
Application Number:
PCT/JP2021/040333
Publication Date:
June 30, 2022
Filing Date:
November 02, 2021
Export Citation:
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Assignee:
FUJIKIN KK (JP)
NIDEC COPAL ELECTRONICS CORP (JP)
International Classes:
G01L19/06
Domestic Patent References:
WO2020075600A12020-04-16
WO2014155994A12014-10-02
Foreign References:
JP2013057512A2013-03-28
US20170363499A12017-12-21
JP2005148002A2005-06-09
Attorney, Agent or Firm:
TANIDA Ryuichi et al. (JP)
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