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Patent Searching and Data


Title:
PRINTED CIRCUIT BOARD HAVING OPTIONAL CIRCUIT UNIT
Document Type and Number:
WIPO Patent Application WO/2024/034884
Kind Code:
A1
Abstract:
A printed circuit board comprises: a first via and a second via which are provided between a first circuit unit and a second circuit unit provided on the upper surface of an insulating layer, and penetrate the insulating layer; a first signal pad which is provided on the upper surface of the insulating layer so as to be connected to the top of the first via, and has only one pad connection unit; a second signal pad which is provided on the upper surface of the insulating layer so as to be connected to the top of the second via, and has only one pad connection unit; a first signal line which is connected to the first circuit unit and includes a first pad provided adjacent to the first signal pad; a second signal line which is connected to the first circuit unit in parallel with the first signal line and includes a second pad provided adjacent to the second signal pad; a third signal line which is connected to the second circuit unit and includes a third pad provided adjacent to the first signal pad; a fourth signal line which is connected to the second circuit unit in parallel with the third signal line and includes a fourth pad provided adjacent to the second signal pad; a first connection element connecting the pad connection unit of the first signal pad to the first pad or the third pad; and a second connection element connecting the pad connection unit of the second signal pad to the second pad or the fourth pad.

Inventors:
OH KIHUN (KR)
Application Number:
PCT/KR2023/010012
Publication Date:
February 15, 2024
Filing Date:
July 13, 2023
Export Citation:
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Assignee:
SAMSUNG ELECTRONICS CO LTD (KR)
International Classes:
H05K1/11; H05K1/18
Foreign References:
JP2018152407A2018-09-27
JP4547035B22010-09-22
US20180277473A12018-09-27
KR20120035196A2012-04-13
JP2000223799A2000-08-11
Attorney, Agent or Firm:
KIM, Tae-hun et al. (KR)
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