Title:
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/184725
Kind Code:
A1
Abstract:
The present application discloses a printed circuit board and a manufacturing method therefor. The printed circuit board comprises at least three common FR4 core boards and a high-frequency board; the high-frequency board and a laminated layer of at least two common FR4 core boards are located on the same layer in the horizontal direction; the high-frequency board and a first common FR4 core board are provided adjacent to each other in the vertical direction; an orthographic projection of the high-frequency board on the printed circuit board covers part of an orthographic projection of the first common FR4 core board on the printed circuit board; orthographic projections of the common FR4 core boards that are located on the same layer as the high-frequency board cover the remaining part of the orthographic projection of the first common FR4 core board on the printed circuit board; and an adhesive layer between the high-frequency board and the first common FR4 core board is provided with a first through groove.
Inventors:
CHEN SHUOQIAN (CN)
TAO XIAOHUI (CN)
CHEN XIAYUAN (CN)
SONG XIANGQUN (CN)
TAO XIAOHUI (CN)
CHEN XIAYUAN (CN)
SONG XIANGQUN (CN)
Application Number:
PCT/CN2022/099824
Publication Date:
October 05, 2023
Filing Date:
June 20, 2022
Export Citation:
Assignee:
SHENGYI ELECTRONICS CO LTD (CN)
International Classes:
H05K1/02; H05K3/46
Foreign References:
| CN114585152A | 2022-06-03 | |||
| CN101699939A | 2010-04-28 | |||
| CN107278062A | 2017-10-20 | |||
| CN104780702A | 2015-07-15 | |||
| CN109587975A | 2019-04-05 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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