Title:
PRINTED CIRCUIT BOARD WITH INTEGRATED COIL, AND MAGNETIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/141673
Kind Code:
A1
Abstract:
In this printed circuit board (3) with an integrated coil, conductive coil patterns (4a through 4e) are formed on a plurality of layers (L1 through L3) and conductive heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provided on a bottom outer layer (L3) so as to correspond to coil patterns (4a through 4d) on a top outer layer (L1) and an inner layer (L2). Each heat-dissipating pattern (5a7 through 5a9, 5b7 through 5b9) is kept separate from the other heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) and the coil pattern (4e) on the bottom outer layer (L3). Corresponding coil patterns (4a through 4d) and heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are connected by conductive heat-dissipating pins (7a through 7f), pads (8c), and through-holes (8).
Inventors:
HACHIYA KOJI (JP)
KOBAYASHI TOMOYOSHI (JP)
NAKABAYASHI KOICHI (JP)
KOBAYASHI TOMOYOSHI (JP)
NAKABAYASHI KOICHI (JP)
Application Number:
PCT/JP2014/001327
Publication Date:
September 18, 2014
Filing Date:
March 10, 2014
Export Citation:
Assignee:
OMRON AUTOMOTIVE ELECTRONICS (JP)
International Classes:
H01F37/00; H01F17/00; H01F17/04; H01F27/08; H01F27/22; H01F27/28; H05K1/02
Domestic Patent References:
| WO2011010491A1 | 2011-01-27 |
Foreign References:
| JP2007059839A | 2007-03-08 | |||
| JP2010161258A | 2010-07-22 | |||
| JP2010153724A | 2010-07-08 | |||
| JP2008502293A | 2008-01-24 | |||
| JP2013062355A | 2013-04-04 |
Attorney, Agent or Firm:
OKUMURA, HIDEYUKI (JP)
Hideyuki Okumura (JP)
Hideyuki Okumura (JP)
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