PRINTED CIRCUIT BOARD WITH INTEGRATED COIL, AND MAGNETIC DEVICE

WIPO Patent Application WO/2014/141674

A1

This printed circuit board (3) with an integrated coil is provided with the following: coil patterns (4a through 4e) formed on a plurality of layers (L1 through L3); through-hole groups (9a through 9d) that electrically connect coil patterns (4a through 4e) on different layers (L1 through L3) to each other; and heat-dissipating pins (7a through 7f), pads (8c), and through-holes (8d) that thermally connect the coil patterns (4a through 4d) on a top outer layer (L1) and an inner layer (L2) to a bottom outer layer (L3). Enlarged regions (4t1 through 4t6) are provided in locations offset from the current pathways of the aforementioned coil patterns (4a through 4d), and heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) are provided on the bottom outer layer (L3) so as to correspond to said coil patterns (4a through 4d). The enlarged regions (4t1 through 4t6) of said coil patterns (4a through 4d) are thermally connected to the corresponding heat-dissipating patterns (5a7 through 5a9, 5b7 through 5b9) by the heat-dissipating pins (7a through 7f) and the like.

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HACHIYA KOJI (JP)
KOBAYASHI TOMOYOSHI (JP)
NAKABAYASHI KOICHI (JP)

PCT/JP2014/001329

September 18, 2014

March 10, 2014

Click for automatic bibliography generation  

OMRON AUTOMOTIVE ELECTRONICS (JP)

H01F37/00; H01F17/00; H01F17/04; H01F27/08; H01F27/22; H01F27/28; H05K1/02

WO2011010491A1

2011-01-27

JP2007059839A	2007-03-08
JP2010161258A	2010-07-22
JP2010153724A	2010-07-08
JP2008502293A	2008-01-24
JP2013062355A	2013-04-04

OKUMURA, HIDEYUKI (JP)
Hideyuki Okumura (JP)

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