Title:
PRINTED LAMINATE FOR PACKAGING
Document Type and Number:
WIPO Patent Application WO/2023/171339
Kind Code:
A1
Abstract:
A printed laminate for packaging comprising a basic layer structure having a barrier film, a printing layer, and an adhesive layer, the polyolefin content of the printed laminate for packaging being adjusted to 80 mass% or greater, wherein the printed laminate for packaging is characterized in that the barrier film comprises a thermoplastic resin film (A1) and an inorganic skin film (A2) formed on a surface of the film (A1), and the elastic storage modulus of the adhesive layer at 120°C is greater than 1.5 MPa.
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Inventors:
EBATA ATSUSHI (JP)
YAMADA TOSHIKI (JP)
MAJIMA KENYA (JP)
YAMADA TOSHIKI (JP)
MAJIMA KENYA (JP)
Application Number:
PCT/JP2023/005983
Publication Date:
September 14, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
TOYO SEIKAN GROUP HOLDINGS LTD (JP)
International Classes:
B65D65/40; B32B7/022; B32B9/00; B32B27/00; B32B27/20; B32B27/32; B32B27/38
Foreign References:
JP2001096664A | 2001-04-10 | |||
JP2016141403A | 2016-08-08 | |||
JP2002182338A | 2002-06-26 | |||
JP2021050295A | 2021-04-01 |
Attorney, Agent or Firm:
ATAGO IP (JP)
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