PRINTED-WIRING BOARD AND PROCESS FOR MANUFACTURE THEREOF

WIPO Patent Application WO/2011/001900

A1

A process for manufacturing a printed-wiring board having an insulating layer, circuit wirings formed from a metal foil on both surfaces of the insulating layer, and conductive paste filled in a via hole for electrically connecting the circuit wirings formed on both surfaces of the insulating layer. The process comprises steps of sticking a masking film on the surface of the circuit wiring on one side of the insulating layer, projecting a first laser beam onto the surface of the stuck masking film to form an aperture through the masking film and through the circuit wiring on one side of the insulating layer, projecting a second laser beam having a spot-diameter larger than the diameter of a ridgeline of a rise caused around the aperture in the masking film to form the via hole through the insulating layer, and filling the conductive paste into the via hole for electrically connecting the circuit wirings.

JPH0821777	PROBLEM TO BE SOLVED: To manufacture a metal core structure
JPS5732695	METHOD OF CONNECTING PRINTED CIRCUIT BOARD
JPH0973928	CONNECTING CIRCUIT CONDUCTOR, MANUFACTURE THEREOF, AND ELECTRICALLY CONNECTING DEVICE

MIYAZAKI KANNA (JP)
YASUDA SHUICHIRO (JP)

PCT/JP2010/060776

January 06, 2011

June 24, 2010

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SONY CHEM & INF DEVICE CORP (JP)
MIYAZAKI KANNA (JP)
YASUDA SHUICHIRO (JP)

H05K3/40; H05K1/11; H05K3/00

JP2007281336A	2007-10-25
JP2007317823A	2007-12-06
JP2006202876A	2006-08-03
JP2003318546A	2003-11-07

HIROTA, Koichi et al. (JP)
Koichi Hirota (JP)

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