Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/163034
Kind Code:
A1
Abstract:
This printed wiring board comprises a base film, a first conductor pattern, a protective layer, an electroconductive adhesive layer, and a conductor film. The base film has a first main surface. The first conductor pattern is disposed on the first main surface. The first conductor pattern has a signal pattern, a first ground pattern, and a second ground pattern extending along a first direction in plan view. The signal pattern is disposed between the first and second ground patterns in a second direction orthogonal to the first direction. The protective layer is disposed on the first main surface so as to cover the first conductor pattern.
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Inventors:
KIYA SATOSHI (JP)
MURATA KAZUO (JP)
UEDA HIROSHI (JP)
YAMAGISHI SUGURU (JP)
KUWAYAMA ICHIRO (JP)
NAKAMURA YUICHI (JP)
FUKUNAGA TAKANORI (JP)
MURATA KAZUO (JP)
UEDA HIROSHI (JP)
YAMAGISHI SUGURU (JP)
KUWAYAMA ICHIRO (JP)
NAKAMURA YUICHI (JP)
FUKUNAGA TAKANORI (JP)
Application Number:
PCT/JP2023/006433
Publication Date:
August 31, 2023
Filing Date:
February 22, 2023
Export Citation:
Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K9/00; H05K1/02
Foreign References:
| JP2009177010A | 2009-08-06 | |||
| JPH07122882A | 1995-05-12 | |||
| US2926317A | 1960-02-23 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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