Title:
PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/282350
Kind Code:
A1
Abstract:
This printed wiring board comprises a base material and a conductor layer. The base material has a first surface and a second surface located on the reverse side from the first surface. A through-hole, which reaches the second surface from the first surface, is formed in the base material. In the first surface of the base material, a first opening of the through-hole is formed. In the second surface of the base material, a second opening of the through-hole is formed. The conductor layer is disposed inside the through-hole. The base material includes a first protruding section. The first protruding section protrudes from the edge section of the first opening. The first opening has a first opening width that passes through the first protruding section and the center of the first opening, and is in a first cross-section along the thickness direction of the base material. The second opening has a second opening width in the first cross-section. The first opening width is smaller than the second opening width.
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Inventors:
TAKAHASHI KENJI (JP)
SAKAI SHOICHIRO (JP)
SAKAI SHOICHIRO (JP)
Application Number:
PCT/JP2022/027124
Publication Date:
January 12, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H05K3/42
Foreign References:
| JP2016201416A | 2016-12-01 | |||
| JP2002198461A | 2002-07-12 | |||
| KR20150011466A | 2015-02-02 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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