Title:
PRINTING SYSTEM, SUBSTRATE CONDITION ADJUSTMENT METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2024/014132
Kind Code:
A1
Abstract:
Provided are a printing system, a substrate condition adjustment method, and a program that can achieve a substrate condition that is suitable for double-sided printing. A printing system (10) that performs double-sided printing comprises: a first liquid chemical application device (16) that applies a liquid chemical to a first surface of a substrate; a second liquid chemical application device (22) that applies a liquid chemical to a second surface of the substrate; a temperature adjustment device (14) that adjusts the temperature of the substrate; and a moisture content adjustment device (14) that adjusts the moisture content of the substrate, wherein the temperature of the substrate at the time of the application of the liquid chemical to the first surface is adjusted to the range of greater than 5.0°C and less than the temperature of the liquid chemical, and a first moisture content of the substrate at the time of the application of the liquid chemical to the first surface is adjusted to range of ±5.0% relative to a second moisture content of the substrate at the time of the application of the liquid chemical to the second surface.
Inventors:
MITSUYASU TAKASHI (JP)
NAKAMURA HAYATE (JP)
NAKAMURA HAYATE (JP)
Application Number:
PCT/JP2023/018923
Publication Date:
January 18, 2024
Filing Date:
May 22, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B41J2/195; B41J2/01; B41M5/00
Domestic Patent References:
| WO2018143052A1 | 2018-08-09 |
Foreign References:
| JP2008068462A | 2008-03-27 | |||
| JP2021154658A | 2021-10-07 | |||
| JP2016159513A | 2016-09-05 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
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