Title:
PROCESS OF ADHERING TITANIUM METAL LAYER TO SUBSTRATE SURFACE
Document Type and Number:
WIPO Patent Application WO/2003/041958
Kind Code:
A1
Abstract:
The present invention described a method of adhering titanium metal layer to substrate surface, comprising : (a) providing heating apparatus and diffusion layer in chamber &semi (b) utilizing platform with through holes which connected to air purge unit &semi (c) placing adhesive layer (solid under room temperature) and titanium metal layer &semi (d) heating chamber to predetermined temperature by heating apparatus and diffusion layer &semi permitting heating energy generated by heating apparatus permeating through diffusion layer so as to homogeneously conducting to titanium metal layer &semi adhesive layer and substrate, melting adhesive layer and rarefying air in chamber &semi (e) sucking through holes by air purge unit, permitting titanium and adhesive layer adhering together to substrate surface smoothly and strongly due to suction.
Inventors:
SUN HUEIHSIN (CN)
CHEN CHINGPING (CN)
CHEN CHINGPING (CN)
Application Number:
PCT/CN2002/000787
Publication Date:
May 22, 2003
Filing Date:
November 05, 2002
Export Citation:
Assignee:
SUN HUEIHSIN (CN)
CHEN CHINGPING (CN)
CHEN CHINGPING (CN)
International Classes:
B23K1/008; (IPC1-7): B32B31/00
Foreign References:
| TW440747B | 2001-06-16 | |||
| JPH0866571A | 1996-03-12 | |||
| JPS5675820A | 1981-06-23 |
Attorney, Agent or Firm:
KANGXIN & PARTNERS (Xinlong Mansion A33 Erlongl, Xicheng District Beijing 2, CN)
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