Title:
PROCESS AND APPARATUS FOR PRODUCING SOLDER-PLATED WIRE
Document Type and Number:
WIPO Patent Application WO/2011/155477
Kind Code:
A1
Abstract:
A process and apparatus for producing a solder-plated wire are provided with which it is possible to stably obtain a plated wire of desired quality including sufficiently lowered 0.2% proof stress and to thereby improve product yield and production efficiency. The apparatus (10) is configured of: a plating pretreatment means (2) in which a copper wire (1a) is pretreated in preparation for plating; a plating means (61) in which the surface of the copper wire (1a) is plated with a solder; and a winding means (71) for winding the copper wire (1a, 1b) having the plated surface. The plating pretreatment means (2) includes a softening/annealing means (51) in which the copper wire (1a) is softened by annealing to reduce the proof stress. The copper wire (1a, 1b) having the lowered proof stress is wound by the winding means (71) at winding force lower than the proof stress of the copper wire (1a, 1b). The softening/annealing means (51), plating means (61), and winding means (71) have been arranged in series in this order from the upstream side along the running direction of the copper wire (1a, 1b).
Inventors:
WAKANA KATSUTOSHI (JP)
KAMIMURA TAKATOSHI (JP)
MASUI TAKAYUKI (JP)
TOMIMATSU SATOSHI (JP)
TOMA KATUYOSHI (JP)
TSUKANO SHUN (JP)
HAYASHI TAKAMASA (JP)
KAMIMURA TAKATOSHI (JP)
MASUI TAKAYUKI (JP)
TOMIMATSU SATOSHI (JP)
TOMA KATUYOSHI (JP)
TSUKANO SHUN (JP)
HAYASHI TAKAMASA (JP)
Application Number:
PCT/JP2011/063008
Publication Date:
December 15, 2011
Filing Date:
June 07, 2011
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
RIKEN ELECTRIC WIRE CO LTD (JP)
WAKANA KATSUTOSHI (JP)
KAMIMURA TAKATOSHI (JP)
MASUI TAKAYUKI (JP)
TOMIMATSU SATOSHI (JP)
TOMA KATUYOSHI (JP)
TSUKANO SHUN (JP)
HAYASHI TAKAMASA (JP)
RIKEN ELECTRIC WIRE CO LTD (JP)
WAKANA KATSUTOSHI (JP)
KAMIMURA TAKATOSHI (JP)
MASUI TAKAYUKI (JP)
TOMIMATSU SATOSHI (JP)
TOMA KATUYOSHI (JP)
TSUKANO SHUN (JP)
HAYASHI TAKAMASA (JP)
International Classes:
C23C2/38; B21C47/00; C23C2/02; C23C2/08; C23C2/10
Foreign References:
| JP2006054355A | 2006-02-23 | |||
| JPS5138891Y2 | 1976-09-24 | |||
| JPH05115902A | 1993-05-14 | |||
| JPH11179422A | 1999-07-06 | |||
| JP2004313881A | 2004-11-11 | |||
| JPH083713A | 1996-01-09 | |||
| JPS6267124A | 1987-03-26 | |||
| JPH055169A | 1993-01-14 | |||
| JPH0533109A | 1993-02-09 | |||
| JP2000282206A | 2000-10-10 | |||
| JPH0397841A | 1991-04-23 |
Attorney, Agent or Firm:
NAGATA Yoshiaki et al. (JP)
Yoshiaki Nagata (JP)
Yoshiaki Nagata (JP)
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Claims: