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Patent Searching and Data


Title:
PROCESS FOR PRODUCTION OF DECORATIVELY PLATED ARTICLES BY UTILIZING THE IMPARTATION OF ELECTROCONDUCTIVITY TO RESIN BY SPUTTERING
Document Type and Number:
WIPO Patent Application WO/2008/004315
Kind Code:
A1
Abstract:
In the process of the invention, surface roughening of a molded resin article and impartation of electroconductivity to the article are conducted by a dry process without conventional chemicals such as chromic acid, which brings about protection of the article from surface deterioration by chemicals, environment load reduction due to nonuse of chemicals having large environment load, inhibition of plated resin articles from exfoliation, and secure safety of the articles. The process comprises the surface cleaning/activation step (S1) of conducting the surface cleaning and surface modification /activation of a molded resin article by gas sputtering, the metal thin film formation step (S2) of forming a metal thin film on the surface of the resulting resin article by metal sputtering, the electroconductive film formation step (S4) of forming an electroconductive film of nickel, copper or the like on the metal thin film by sputtering, and the final electroplating step of electroplating the resulting resin article.

Inventors:
KAKIHARA KUNIHIRO (JP)
NODA YOSHINORI (JP)
OURO TAKASHI (JP)
Application Number:
PCT/JP2006/313968
Publication Date:
January 10, 2008
Filing Date:
July 13, 2006
Export Citation:
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Assignee:
KAKIHARA KOGYO CO LTD (JP)
KAKIHARA KUNIHIRO (JP)
NODA YOSHINORI (JP)
OURO TAKASHI (JP)
International Classes:
C23C28/00; C23C14/06; C25D5/56
Foreign References:
JPH06212405A1994-08-02
JP2001104875A2001-04-17
JP2002293967A2002-10-09
JPH03257840A1991-11-18
JPH05311486A1993-11-22
JPH03229890A1991-10-11
Attorney, Agent or Firm:
TAKEMASA, Yoshiaki et al. (4-3 Mita 3-chom, Minato-ku Tokyo 73, JP)
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