PROCESSING DEVICE, AND METHOD FOR MANUFACTURING PROCESSED ARTICLE

WIPO Patent Application WO/2022/201701

A1

The present invention simplifies the device configuration of a processing device having a blade replacement mechanism and reduces the footprint of the processing device, the present invention being provided with cutting tables 2A, 2B on which a sealed substrate W is processed by a cutting mechanism 4, a cutting movement mechanism 8 for causing the cutting mechanism 4 to move in a first direction and a second direction that are orthogonal to each other in a horizontal plane, and a blade replacement mechanism 24 for replacing blades 41A, 41B of the cutting mechanism 4. The cutting movement mechanism 8 has a pair of first guide rails 811 provided along the first direction so as to sandwich the cutting tables 2A, 2B, and a support body 812 that moves along the pair of first guide rails 811 and that supports the cutting mechanism 4 so as to enable movement along the second direction. The blade replacement mechanism 24 has a first chucking unit 241a that chucks the blades 41a, 41b, and an arm movement mechanism 242 that causes the first chucking unit 241a to move in the second direction.

FUKAI MOTOKI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
YAMAMOTO YUKO (JP)
YOSHIOKA SHO (JP)
KATAOKA SHOICHI (JP)

PCT/JP2021/047768

September 29, 2022

December 23, 2021

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TOWA CORP (JP)

B24B45/00; B23Q3/155; B24B27/06; B24B41/06; B24B53/00; B24B53/12; H01L21/301; H01L21/677

JP2021020281A	2021-02-18
JP2008147344A	2008-06-26
JP2008135519A	2008-06-12
JP2016092237A	2016-05-23
JPS6253804A	1987-03-09
JP2014054713A	2014-03-27
JP2018195729A	2018-12-06

NISHIMURA, Ryuhei (JP)

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