Title:
PROCESSING DEVICE AND PROCESSED ARTICLE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/201700
Kind Code:
A1
Abstract:
The present invention reduces footprint of a processing device, and comprises: a substrate accommodating unit 111 that accommodates an encapsulated substrate W; a cutting table 2A, 2B on which the encapsulated substrate W is processed by a cutting mechanism 4; a reception stage 115 that receives the encapsulated substrate W from the substrate accommodating unit 111; a stage moving mechanism 117 having a moving rail 117a for moving the reception stage 115 to a conveyance position; a first holding mechanism 3 that holds the encapsulated substrate W for conveying to the cutting table 2A, 2B; and a conveyance moving mechanism 7 having a transfer shaft 71 for moving the first holding mechanism 3 between the reception stage 115 in the conveyance position and the cutting table 2A, 2B. The transfer shaft 71 and the moving rail 117a are orthogonal to each other in a plan view.
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Inventors:
FUKAI MOTOKI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
YAMAMOTO YUKO (JP)
YOSHIOKA SHO (JP)
KATAOKA SHOICHI (JP)
HORI SATOKO (JP)
SAKAUE YUYA (JP)
YAMAMOTO YUKO (JP)
YOSHIOKA SHO (JP)
KATAOKA SHOICHI (JP)
Application Number:
PCT/JP2021/047767
Publication Date:
September 29, 2022
Filing Date:
December 23, 2021
Export Citation:
Assignee:
TOWA CORP (JP)
International Classes:
B23Q7/04; B24B27/06; B24B41/06; B24B45/00; H01L21/301; H01L21/677
Domestic Patent References:
| WO2019208338A1 | 2019-10-31 |
Foreign References:
| JP2010125488A | 2010-06-10 | |||
| JP2018181951A | 2018-11-15 | |||
| JP2007134551A | 2007-05-31 | |||
| KR20070042336A | 2007-04-23 | |||
| JP2013058623A | 2013-03-28 |
Attorney, Agent or Firm:
NISHIMURA, Ryuhei (JP)
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