Title:
PRODUCTION DEVICE AND PRODUCTION METHOD FOR HAIRPIN CONDUCTOR
Document Type and Number:
WIPO Patent Application WO/2023/238739
Kind Code:
A1
Abstract:
A production device (91) for a hairpin conductor comprises an index table (71) that intermittently rotates around a rotational axis (CL7), a plurality of grippers (721–726) that are attached to the index table (71) at an angular pitch (θp) and can grip a cut wire (Wc), and a plurality of station devices (1–5) that are installed around the index table (71) at the angular pitch (θp) and shape the cut wire (Wc) into a three-dimensional hairpin conductor (Wg). The station devices (1–5) include bending devices (1–3) and a press device (4) and have a set installation order in the rotation direction of the index table (71). The press device (4) includes a rotating mold table (43) on which a set (4P) of molds that comprise an upper mold (42) and a lower mold (41) are installed along the circumferential direction. Rotation of the mold table (43) sets one of the set (4P) of molds at a pressing position.
More Like This:
| WO/2016/104103 | COIL FORMING DEVICE AND COIL FORMING METHOD |
| JP2021090333 | COIL SEGMENT MOLDING DEVICE |
Inventors:
YAMAGUCHI TAKEHITO (JP)
SATOU YUTAKA (JP)
SATOU YUTAKA (JP)
Application Number:
PCT/JP2023/020121
Publication Date:
December 14, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
AMADA CO LTD (JP)
AMADA PRESS SYSTEM CO LTD (JP)
AMADA PRESS SYSTEM CO LTD (JP)
International Classes:
H02K15/04; B21F1/00
Foreign References:
| JP2003143818A | 2003-05-16 | |||
| JP2014007793A | 2014-01-16 | |||
| CN107252856A | 2017-10-17 | |||
| CN108942241A | 2018-12-07 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
Download PDF:
Previous Patent: MANUFACTURING APPARATUS AND MANUFACTURING METHOD FOR HAIRPIN CONDUCTOR
Next Patent: ETCHING METHOD AND PLASMA PROCESSING DEVICE
Next Patent: ETCHING METHOD AND PLASMA PROCESSING DEVICE