Title:
PRODUCTION METHOD FOR SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/243666
Kind Code:
A1
Abstract:
An embodiment of the present invention provides a production method that is for a semiconductor substrate and that uses a detergent composition having excellent abilities in removing an adhesive agent. The present disclosure pertains to a production method that is for a semiconductor substrate and that comprises: (1) a step for adhering a wafer to a fixation member using an adhesive agent; (2) a step for polishing a surface, of the wafer, on the reverse side of the surface to which the fixation member is adhered; (3) a step for processing the polished surface of the wafer; (4) a step for separating the processed wafer from the fixation member; and (5) a step for removing the adhesive agent remaining on the separated wafer using a detergent. Step (3) includes subjecting the wafer fixed to the fixation member using the adhesive agent to a heat treatment at a temperature of at least 230°C. The detergent used in step (5) is a detergent composition which contains an alkanolamine (component A) and a glycol ether (component B) represented by formula (I), and in which the contained amount of component A is 35-85 mass%. (I): R-O-(EO)n-H
Inventors:
YAMADA KOUHEI
Application Number:
PCT/JP2023/022112
Publication Date:
December 21, 2023
Filing Date:
June 14, 2023
Export Citation:
Assignee:
KAO CORP (JP)
International Classes:
H01L21/304; C11D7/26; C11D7/32; C11D7/50
Domestic Patent References:
| WO2016194917A1 | 2016-12-08 |
Foreign References:
| JP2009114268A | 2009-05-28 | |||
| JPH11286698A | 1999-10-19 |
Attorney, Agent or Firm:
IKEUCHI & PARTNERS (JP)
Download PDF: