Title:
PRODUCTION METHOD FOR SOLDER TRANSFER BASE MATERIAL, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER BASE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2012/063386
Kind Code:
A1
Abstract:
Provided is a production method for a solder transfer base material which makes forming a solder layer with a thickness that is appropriate for the electronic part or circuit board. The production method is provided with: an adhesive layer forming process, in which an adhesive layer (2) is formed on the surface of a base material; a solder layer forming process, in which a solder layer is formed by positioning a plurality of solder powder bodies (3) in such a way that openings are formed between the solder powder bodies; and a filler supplying process in which fillers (4) are supplied between the solder powder into the openings formed on the adhesive layer.
Inventors:
SAKURAI DAISUKE
Application Number:
PCT/JP2011/004731
Publication Date:
May 18, 2012
Filing Date:
August 25, 2011
Export Citation:
Assignee:
PANASONIC CORP (JP)
SAKURAI DAISUKE
SAKURAI DAISUKE
International Classes:
B23K1/20; B23K1/00; B23K3/06; H01L21/60; H05K3/24; H05K3/34; B23K101/40
Domestic Patent References:
| WO2010093031A1 | 2010-08-19 | |||
| WO2007099866A1 | 2007-09-07 |
Foreign References:
| JPH05198933A | 1993-08-06 | |||
| JP2009010302A | 2009-01-15 |
Attorney, Agent or Firm:
TOKKYOGYOMUHOUJIN MATSUDAKOKUSAITOKKYOJIMUSYO (JP)
Patent business corporation Matsuda international patent firm (JP)
Patent business corporation Matsuda international patent firm (JP)
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Claims: