Title:
PROTECTIVE FILM FORMATION AGENT, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP
Document Type and Number:
WIPO Patent Application WO/2024/034345
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a protective film formation agent that is used, in dicing of a semiconductor wafer, in order to form a protective film on the surface of the semiconductor wafer, and that is capable of forming a protective film that has excellent laser machining properties and in which the occurrence of cracking is inhibited; and a method for manufacturing a semiconductor chip using the protective film formation agent. The protective film formation agent includes a water-soluble resin (A), a light absorbing agent (B), at least one type of plasticizing agent (C), and a solvent (S). The water-soluble resin (A) preferably includes a water-soluble resin (A1) that has an aromatic ring and a water-soluble group.
Inventors:
MANIWA HITOMI (JP)
KINOSHITA TETSURO (JP)
KINOSHITA TETSURO (JP)
Application Number:
PCT/JP2023/026547
Publication Date:
February 15, 2024
Filing Date:
July 20, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
H01L21/301; B23K26/364; C08L101/02
Domestic Patent References:
| WO2022153858A1 | 2022-07-21 |
Foreign References:
| JP2014172932A | 2014-09-22 | |||
| CN104744987A | 2015-07-01 | |||
| JP2022112001A | 2022-08-01 | |||
| JP2018174310A | 2018-11-08 | |||
| JP2023041313A | 2023-03-24 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
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