Title:
PROTECTIVE FILM FORMING COMPOSITION, PROTECTIVE FILM FORMING SHEET, AND CHIP PROVIDED WITH PROTECTIVE FILM
Document Type and Number:
WIPO Patent Application WO/2015/068842
Kind Code:
A1
Abstract:
Provided are: a protective film forming composition that can produce a chip that is provided with a protective film and that is highly reliable, and that can form a protective film having favorable heat radiating properties and visibility of a laser printed section and superior adhesiveness resulting from a chip mounter or the like; a protective film forming sheet; and a chip provided with a protective film. The protective film forming composition contains a polymer component (A), a curable component (B), and a heat-conductive filler (C) having an average particle size of 2.0-10.0 μm, wherein the amount contained of components that are liquid at 25°C contained in the protective film forming composition is 20-70 parts by mass for every 100 parts by mass of the total of component (A) and component (B), and the amount contained of component (C) is 40-65 vol% of the total quantity of the protective film forming composition.
Inventors:
YAMAMOTO DAISUKE (JP)
YONEYAMA HIROYUKI (JP)
YONEYAMA HIROYUKI (JP)
Application Number:
PCT/JP2014/079759
Publication Date:
May 14, 2015
Filing Date:
November 10, 2014
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L23/00; C08K3/00; C08L33/06; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2007119507A1 | 2007-10-25 |
Foreign References:
| JP2004214288A | 2004-07-29 |
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Tamotsu Otani (JP)
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