Title:
PROTECTIVE TAPE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2015/162808
Kind Code:
A1
Abstract:
Provided are a protective tape that can achieve excellent connective properties, and a semiconductor device manufacturing method using the same. The protective tape has an adhesive layer (11), a thermoplastic resin layer (12), and a substrate film layer (13) in that order. The modulus ratio between a storage shear modulus of the adhesive layer (11) and a storage shear modulus of the thermoplastic resin layer (12), at an adhering temperature when the protective tape is adhered, is 0.01 or less. Due to this configuration, residual resin on a bump is suppressed, and thus excellent connective properties can be achieved.
Inventors:
MORIYAMA HIRONOBU (JP)
DEGUCHI SHINGO (JP)
YAGI HIDEKAZU (JP)
ISHIMATSU TOMOYUKI (JP)
DEGUCHI SHINGO (JP)
YAGI HIDEKAZU (JP)
ISHIMATSU TOMOYUKI (JP)
Application Number:
PCT/JP2014/071532
Publication Date:
October 29, 2015
Filing Date:
August 18, 2014
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
B32B27/00; C09J7/29; H01L21/301; H01L21/304
Domestic Patent References:
| WO2006118033A1 | 2006-11-09 | |||
| WO2012026431A1 | 2012-03-01 | |||
| WO2011152045A1 | 2011-12-08 | |||
| WO2006014000A1 | 2006-02-09 |
Foreign References:
| JP2012169484A | 2012-09-06 | |||
| JP2013087131A | 2013-05-13 | |||
| JP2012074623A | 2012-04-12 | |||
| JP2014017336A | 2014-01-30 | |||
| JP2005028734A | 2005-02-03 | |||
| JP2005028734A | 2005-02-03 |
Other References:
See also references of EP 2985328A4
Attorney, Agent or Firm:
NOGUCHI, NOBUHIRO (JP)
Nobuhiro Noguchi (JP)
Nobuhiro Noguchi (JP)
Download PDF: