QUANTUM CHIP AND QUANTUM COMPUTER

WIPO Patent Application WO/2022/110784

A1

The present application relates to the technical field of quantum computing, and provides a quantum chip and a quantum computer, for use in solving the problems of large manufacturing difficulty, low yield and the like of a quantum chip. The quantum chip provided by the present application comprises: a substrate, M sub-chips, a coupling structure, and a cavity mode suppression structure. Each sub-chip comprises N qubits, and the M sub-chips are disposed on a board surface of the substrate at intervals. The coupling structure is used for interconnecting the M sub-chips. The cavity mode suppression structure is arranged at the edge of each sub-chip and/or in a gap among the M sub-chips, and is used for improving the cavity mode frequency of the quantum chip, M being a positive integer greater than 1, and N being a positive integer greater than or equal to 1. In the quantum chip provided by the present application, the quantum chip consists of M sub-chips, so that the manufacturing difficulty is effectively reduced and the manufacturing yield is improved; moreover, when a quality defect occurs in a certain sub-chip, the problems of large cost, the waste of resources and the like caused by quality defects are avoided.

JP6743255	Elimination of leaks in qubits
JP2023032959	ARITHMETIC DEVICE
JP7372375	quantum error correction

LUO YANXING (CN)
ZHAO PENG (CN)
TANG XIANFENG (CN)
DAI KUNZHE (CN)

PCT/CN2021/101720

June 02, 2022

June 23, 2021

Click for automatic bibliography generation  

HUAWEI TECH CO LTD (CN)

G06N10/00

WO2020036673A2

2020-02-20

US10452991B1	2019-10-22
CN111523672A	2020-08-11
CN111967603A	2020-11-20
CN202011341553A	2020-11-25

See also references of EP 4235519A4

TDIP & PARTNERS (CN)

View/Download PDF      PDF Help

Previous Patent: MOTOR STATOR AND DRIVE MOTOR

Next Patent: POSITIONING METHOD AND APPARATUS, ELECTRONIC DEVICE, STORAGE MEDIUM, COMPUTER PROGRAM PRODUCT, AND C...