RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, AND WATER REPELLENCY-IMPROVING AGENT

WIPO Patent Application WO/2022/131095

A1

Provided are: a radiation-sensitive resin composition which exhibits good sensitivity and can form a resist pattern having high water repellency and few defects; and a resist pattern formation method and a water repellency-improving agent using same.　This radiation-sensitive resin composition contains a resin A having a first structural unit containing a partial structure represented by formula (1). In formula (1), X is a divalent linking group.　R1 and R2 are each independently a monovalent chain-like hydrocarbon group having 1-40 carbon atoms, a monovalent alicyclic hydrocarbon group having 3-20 carbon atoms, a monovalent aromatic hydrocarbon group having 6-12 carbon atoms, or a monovalent fluorinated hydrocarbon group having 1-40 carbon atoms, or R1 and R2 bond to each other to form a 3- to 20-membered ring structure (a) together with the carbon atom to which these are bonded.　R3 is a fluorinated chain-like hydrocarbon group having 1-4 carbon atoms.　＊ denotes a position of linking to a polymer main chain.　The radiation-sensitive resin composition also contains: resin B containing a structural unit having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent.

NEMOTO RYUICHI (JP)
FURUKAWA TAIICHI (JP)
FURUKAWA TSUYOSHI (JP)
INAMI HAJIME (JP)
YOKOI HIROKI (JP)
UCHIDA MAYO (JP)

PCT/JP2021/045081

June 23, 2022

December 08, 2021

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JSR CORP (JP)

C08F12/22; C08F20/12; G03F7/038; G03F7/039; G03F7/20

JP2011203645A	2011-10-13
JP2014167589A	2014-09-11

UNIUS PATENT ATTORNEYS OFFICE (JP)

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