RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD

WIPO Patent Application WO/2023/228843

A1

Provided are: a radiation-sensitive resin composition, from which a resist film capable of exhibiting satisfactory levels of sensitivity, LWR performance, DOF performance and pattern rectangularity can be formed in the formation of a resist pattern having a high aspect ratio; and a pattern formation method. This radiation-sensitive resin composition comprises an onium salt compound represented by formula (1), a resin containing a structural unit having an acid-dissociable group, and an alcohol-type solvent having a boiling point of 90°C or higher. (In formula (1), R1 represents a substituted or unsubstituted monovalent hydrocarbon group having 1 to 5 carbon atoms, or a group having such a structure that a bivalent hetero-atom-containing group is contained between carbon atoms in a carbon-carbon bond in the aforementioned hydrocarbon group; R2 and R3 each independently represent a hydrogen atom, or a monovalent hydrocarbon group; one of Rf11 and Rf12 represents a fluorine atom and the other represents a fluorine atom or a monovalent fluorinated hydrocarbon group; and Z1 + represents a monovalent radiation-sensitive onium cation.)

NEMOTO RYUICHI (JP)
MIYAKE MASAYUKI (JP)
INAMI HAJIME (JP)
FURUKAWA TSUYOSHI (JP)
OTSUKA NOBORU (JP)
MIYAO KENSUKE (JP)

PCT/JP2023/018519

November 30, 2023

May 18, 2023

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JSR CORP (JP)

G03F7/004; G03F7/039; G03F7/20

JP2011002805A	2011-01-06
JP2011075687A	2011-04-14
JP2010020204A	2010-01-28

UNIUS PATENT ATTORNEYS OFFICE (JP)

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