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Patent Searching and Data


Title:
RADIATION-SENSITIVE RESIN COMPOSITION, RESIST PATTERN FORMATION METHOD, AND ACID DIFFUSION CONTROL AGENT
Document Type and Number:
WIPO Patent Application WO/2017/122528
Kind Code:
A1
Abstract:
The present invention is a radiation-sensitive resin composition containing a first polymer having first structural units that contain acid-dissociating groups, a radiation-sensitive acid generator, and a first compound in which the structure can change within the molecule and form a salt due to exposure to radiation. The first compound is preferably a compound in which basicity changes due to exposure to radiation. The first compound is preferably a compound in which an acid is generated due to exposure to radiation. The first compound is preferably represented by formula (1). In formula (1), Ar1 is a substituted or unsubstituted 4- to 30-member heteroarene-diyl group in which at least one nitrogen atom is included as a ring-constituting atom.

Inventors:
KINOSHITA NATSUKO (JP)
Application Number:
PCT/JP2016/088799
Publication Date:
July 20, 2017
Filing Date:
December 26, 2016
Export Citation:
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Assignee:
JSR CORP (JP)
International Classes:
G03F7/004; C08F220/28; G03F7/038; G03F7/039; G03F7/20
Foreign References:
JP2012234038A2012-11-29
JP2015068860A2015-04-13
US3050389A1962-08-21
JP2013185107A2013-09-19
JP2013250431A2013-12-12
JP2015022074A2015-02-02
JP2010026395A2010-02-04
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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