Title:
RADIATION SHIELDING FILM AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/211009
Kind Code:
A1
Abstract:
The present application relates to a radiation shielding film using tungsten powder and a preparation method for the radiation shielding film. The radiation shielding film is prepared in the form of an ultra-thin film while still including tungsten particles at high density, as eco-friendly radiation shielding materials that replace lead, and thus may be excellent in both flexibility and radiation shielding ratio, thereby being usefully applicable in radiation shielding suits for medical institutions as well as in various fields requiring radiation shielding films. The radiation shielding film includes tungsten powder and a polymer base, wherein the tungsten powder has an average particle size of 80-200 nm, and the film has a thickness of 0.1-0.025 mm.
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Inventors:
KIM SEONCHIL (KR)
Application Number:
PCT/KR2023/004824
Publication Date:
November 02, 2023
Filing Date:
April 10, 2023
Export Citation:
Assignee:
UNIV KEIMYUNG IACF (KR)
International Classes:
G21F1/10; C08J5/18; C08K3/08; C08L101/00; G21F1/12
Domestic Patent References:
| WO2013039195A1 | 2013-03-21 |
Foreign References:
| JP2022522332A | 2022-04-18 | |||
| KR20100047510A | 2010-05-10 | |||
| JP5848991B2 | 2016-01-27 | |||
| KR101860052B1 | 2018-05-23 |
Attorney, Agent or Firm:
YUN, Kuisang (KR)
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