Title:
RADIO-FREQUENCY FRONT-END ASSEMBLY USING HIGH-PERFORMANCE CERAMIC MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/173969
Kind Code:
A1
Abstract:
Disclosed in the present invention is a radio-frequency front-end assembly. The radio-frequency front-end assembly comprises a radio-frequency assembly, which comprises at least one installation frame having a groove, wherein at least one core power division network substrate is provided in each installation frame; at least one radiation unit is provided on a front surface of the core power division network substrate, a circuit is provided on a back face of the core power division network substrate, and at least one through hole is provided in the core power division network substrate; a pin of the radiation unit penetrates through the through hole of the core power division network substrate and is connected to the circuit on the back face of the core power division network substrate; and a signal leading-out end is provided in the through hole of the core power division network substrate, and penetrates through the installation frame to transmit a signal to a signal processing unit at a rear section. The radio frequency front-end assembly in the present invention significantly reduces transmission loss and the interference of an external signal on a system, such that the working efficiency of the assembly is greatly improved, thereby achieving a significant effect of improving system sensitivity and reducing the energy consumption of the whole system.
More Like This:
| JP3909844 | RADIO COMMUNICATION APPARATUS |
| JP3931402 | CORDLESS TELEPHONE SET |
| JP4045978 | Digital signal transceiver |
Inventors:
XUE BING (CN)
CHEN BINGHONG (CN)
GAO MIAO (CN)
CHEN BINGHONG (CN)
GAO MIAO (CN)
Application Number:
PCT/CN2023/075416
Publication Date:
September 21, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
NANJING RUIJI COMMUNICATION TECH CO LTD (CN)
International Classes:
H04B1/40; C04B35/453; H01Q1/36
Foreign References:
| CN114745018A | 2022-07-12 | |||
| CN110190382A | 2019-08-30 | |||
| CN106830948A | 2017-06-13 | |||
| CN112467368A | 2021-03-09 | |||
| CN113540759A | 2021-10-22 |
Other References:
HONG-YU LIU, LI JUN, JIA SHAO-XIONG: "Research on the Process of Cavity Forming After LTCC Substrate Lamination", SCI-TECH INNOVATION AND PRODUCTIVITY, 中国电子科技集团公司第二研究所,山西 太原 030024, vol. 328, no. 5, 10 May 2021 (2021-05-10), pages 77 - 82, XP093091774, ISSN: 1674-9146, DOI: 10.3969/j.issn.1674-9146.2021.05.077
Attorney, Agent or Firm:
BEIJING XINRUISEN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
Download PDF: