Title:
RECYCLABLE RETAINING RING ASSEMBLY FOR A CHEMICAL MECHANICAL POLISHING APPARATUS
Document Type and Number:
WIPO Patent Application WO2001023135
Kind Code:
A3
Abstract:
An annular ring assembly (34) is provided in which mechanical elements of the retaining ring assembly maintain strict planar flatness, rigidity, high tolerances and surface stability control. Additionally, glues, adhesives, and epoxies are eliminated from the construction of the plastic retaining and backing ring assembly (32). Further, adverse chemical reaction and contamination from adhesives that are typically in direct contact with chemical slurry and substrate layers undergoing polishing are eliminated. As a result, the present invention provides a low cost alternative to suppliers and manufacturers of retaining rings and facilitates a method to exchange, recondition and recycle the retaining ring for an infinite period, thus reducing consumable waste materials. Further, the ring assembly maintains uniform mechanical properties and strict tolerances after post reconditioning, thus reducing the variability and maintaining process consistency.
Inventors:
GONZALEZ JOSE
JORDAN DAVE
TUDHOPE ANDREW
JORDAN DAVE
TUDHOPE ANDREW
Application Number:
PCT/US2000/026872
Publication Date:
December 04, 2003
Filing Date:
September 29, 2000
Export Citation:
Assignee:
SEMICONDUCTOR EQUIPMENT TECHNO (US)
International Classes:
B24B37/32; (IPC1-7): B24B47/02
Foreign References:
| US6080040A | 2000-06-27 |
Other References:
See also references of EP 1385671A4
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