Title:
WAFER GRINDER
Document Type and Number:
WIPO Patent Application WO/2001/023138
Kind Code:
A1
Abstract:
A wafer grinder is provided with a retainer ring unlikely to damage a wafer. In the wafer grinder, a wafer (54) is ground with a layer of compressed air formed between a career (24) and the wafer (54), and a retainer ring (30) for preventing the wafer (54) from leaving the career (24) is formed such that it elastically deforms to meet the border of the wafer (54) when pressed by the wafer (54). Since the wafer (54) is urged in contact with the retainer ring (30) during grinding, the pressure acting on the wafer (54) from the retainer ring (30) is distributed so that the wafer (54) may not suffer damage.
Inventors:
INABA TAKAO (JP)
NUMOTO MINORU (JP)
NUMOTO MINORU (JP)
Application Number:
PCT/JP1999/005291
Publication Date:
April 05, 2001
Filing Date:
September 28, 1999
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
INABA TAKAO (JP)
NUMOTO MINORU (JP)
INABA TAKAO (JP)
NUMOTO MINORU (JP)
International Classes:
H01L21/304; B24B37/04; B24B37/30; B24B37/32; B24B49/16; (IPC1-7): B24B37/04; H01L21/304
Foreign References:
| EP0881039A2 | 1998-12-02 | |||
| EP0896858A1 | 1999-02-17 |
Attorney, Agent or Firm:
Matsuura, Kenzo (Nishi-Shinjuku 1-chome Shinjuku-ku Tokyo, JP)
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