Title:
REFLOW FILM, SOLDER BUMP FORMATION METHOD, SOLDER JOINT FORMATION METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/062095
Kind Code:
A1
Abstract:
The present invention relates to a film which contains solder particles and a thermoplastic resin which can be dissolved by a solvent. In this reflow film, the solder particles are scattered throughout the film. Also provided is a solder bump formation method which comprises (A) mounting the reflow film at an electrode surface side of a substrate, (B) mounting and fixing a flat plate, (C) heating, and (D) dissolving and removing the reflow film. According to the present invention, a solder component is unevenly distributed on an electrode of the substrate through self-organization so that the reflow film has high storability, transportability, and usability, and solder bumps or solder joints are formed selectively only on the electrode.
Inventors:
MIYAUCHI KAZUHIRO (JP)
SUZUKI NAOYA (JP)
TAKANO NOZOMU (JP)
YAMASHITA YUKIHIKO (JP)
SUZUKI NAOYA (JP)
TAKANO NOZOMU (JP)
YAMASHITA YUKIHIKO (JP)
Application Number:
PCT/JP2012/077759
Publication Date:
May 02, 2013
Filing Date:
October 26, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/60; B23K1/00; B23K1/20; B23K3/06; B23K31/02; B23K35/14; B23K35/26; C22C12/00; C22C13/00; C22C28/00; H05K3/34
Domestic Patent References:
| WO2008054011A1 | 2008-05-08 | |||
| WO2006123554A1 | 2006-11-23 |
Foreign References:
| JP2006114865A | 2006-04-27 | |||
| JPH08274454A | 1996-10-18 | |||
| JP2005159102A | 2005-06-16 | |||
| JP2011233550A | 2011-11-17 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
Download PDF:
Claims:
Previous Patent: WELD STRUCTURE OF THIN MEMBER AND ATTACHMENT MEMBER
Next Patent: OPTICAL ELEMENT AND MACH-ZEHNDER OPTICAL WAVEGUIDE ELEMENT
Next Patent: OPTICAL ELEMENT AND MACH-ZEHNDER OPTICAL WAVEGUIDE ELEMENT