Title:
RESIN COMPONENT FOR COOLING STRUCTURE, COOLING STRUCTURE, AND STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/228676
Kind Code:
A1
Abstract:
A resin component for a cooling structure, comprising a first resin portion 100A and a second resin portion 100B that is joined to the first resin portion, wherein a first joint surface of the first resin portion that is joined to the second resin portion has a first recessed portion 120A, a second joint surface of the second resin portion that is joined to the first resin portion has a second recessed portion 120B, and the first recessed portion and the second recessed portion are positioned so as to face each other.
Inventors:
ITO SEIICHI (JP)
YAMASHITA TAKAHIRO (JP)
SHODA HIROAKI (JP)
FUKUKAWA YUJI (JP)
YAMASHITA TAKAHIRO (JP)
SHODA HIROAKI (JP)
FUKUKAWA YUJI (JP)
Application Number:
PCT/JP2023/016522
Publication Date:
November 30, 2023
Filing Date:
April 26, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
F28F21/06; F28D15/02; H01L23/473; H05K7/20
Foreign References:
| JP2020194695A | 2020-12-03 | |||
| JP2020176677A | 2020-10-29 | |||
| JP2015000547A | 2015-01-05 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
Download PDF: