Title:
RESIN COMPOSITION, ADHESIVE AGENT, AND SEALING AGENT
Document Type and Number:
WIPO Patent Application WO/2016/143777
Kind Code:
A1
Abstract:
Provided is a photosetting and thermosetting resin composition that suppresses decrease of adhesion strength in a moisture resistance test on the cured resin composition, and that has a sufficiently long pot life. The resin composition is characterized by containing (A) an acrylic resin, (B) a multifunctional nitrogen-containing heterocyclic compound represented by a specific chemical formula, (C) a latent curing agent, (D) a radial polymerization inhibitor, and (E) an anionic polymerization inhibitor. The resin composition preferably further contains (F) a compound other than acrylic resins with a glycidyl group.
Inventors:
IWAYA KAZUKI (JP)
ARAI FUMINORI (JP)
ARAI FUMINORI (JP)
Application Number:
PCT/JP2016/057106
Publication Date:
September 15, 2016
Filing Date:
March 08, 2016
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/04; C08K3/38; C08K5/057; C08K5/13; C08K5/32; C08K5/37; C08K5/50; C08L33/00; C08L63/08; C09J11/06; C09J133/00; C09J163/08; C09K3/10
Domestic Patent References:
| WO2013005471A1 | 2013-01-10 | |||
| WO2005052021A1 | 2005-06-09 | |||
| WO2013137087A1 | 2013-09-19 | |||
| WO2015141347A1 | 2015-09-24 | |||
| WO2016027716A1 | 2016-02-25 |
Foreign References:
| JPS60108430A | 1985-06-13 | |||
| JP2015059099A | 2015-03-30 |
Attorney, Agent or Firm:
WATARAI YUSUKE (JP)
Yuusuke Watarai (JP)
Yuusuke Watarai (JP)
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