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Title:
RESIN COMPOSITION, ADHESIVE FILM, BONDING SHEET FOR INTERLAYER BONDING, RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE WITH ANTENNA, AND SEMICONDUCTOR PACKAGE WITH ANTENNA
Document Type and Number:
WIPO Patent Application WO/2023/053749
Kind Code:
A1
Abstract:
Provided is a resin composition that has excellent resistance to soldering heat, has a low dielectric characteristic at an initial state, and can suppress changes in dielectric characteristics when left for an extended period at a high temperature.　The composition includes: (A) polyphenylene ether having a styrene structure at an end; and (B) styrene elastomer having an amino group, where the content of component (B) is 70-1100 parts by mass with respect to 100 parts by mass of component (A).

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Inventors:
USAMI RYO (JP)
TAKASUGI HIROSHI (JP)
Application Number:
PCT/JP2022/030845
Publication Date:
April 06, 2023
Filing Date:
August 15, 2022
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08F299/02; C08K5/14; C08L27/18; C08L53/02; C08L63/00; C08L71/12; C09J7/35; C09J109/06; C09J171/12; H01L23/28; H01L23/29; H01L23/31; H01L25/00
Domestic Patent References:
WO2021024364A12021-02-11
WO2022172759A12022-08-18
Foreign References:
JP2019172803A2019-10-10
JP2019099712A2019-06-24
JP2020094172A2020-06-18
JP6909342B12021-07-28
CN112457651A2021-03-09
Attorney, Agent or Firm:
WATANABE Kazuhira (JP)
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