Title:
RESIN COMPOSITION AND ALUMINA POWDER USED THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/210492
Kind Code:
A1
Abstract:
Provided is a resin composition having a high content of alumina powder, wherein during a manufacturing stage, a mixture comprising the alumina powder and an uncured resin has good moldability. The resin composition comprises a resin and an alumina powder, wherein the alumina powder includes: first alumina particles having a particle diameter D50 of more than 100 μm and a BET specific surface area of at most 0.085 m2/g as measured according to the Krypton adsorption method; and second alumina particles having a particle diameter D50 of 0.1 μm to 1.0 μm.
Inventors:
ARISE ICHIRO (JP)
NAKATA KUNIHIKO (JP)
NAKAYAMA ATSUSHI (JP)
UEMATSU HIROTO (JP)
NAKATA KUNIHIKO (JP)
NAKAYAMA ATSUSHI (JP)
UEMATSU HIROTO (JP)
Application Number:
PCT/JP2023/015760
Publication Date:
November 02, 2023
Filing Date:
April 20, 2023
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08L101/00; C01F7/027; C08K3/22
Domestic Patent References:
| WO2020138335A1 | 2020-07-02 | |||
| WO2021225059A1 | 2021-11-11 | |||
| WO2009133904A1 | 2009-11-05 | |||
| WO2018230370A1 | 2018-12-20 | |||
| WO2018181600A1 | 2018-10-04 | |||
| WO2008053536A1 | 2008-05-08 |
Foreign References:
| JP2020180200A | 2020-11-05 | |||
| JPH10237311A | 1998-09-08 | |||
| JP2006169090A | 2006-06-29 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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