Title:
RESIN COMPOSITION, APPLICATION THEREOF, AND MOLDING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2023/166943
Kind Code:
A1
Abstract:
A resin composition for melt molding according to the present invention is prepared, the resin composition containing a thermoplastic resin and a sugar ester and being used for melt molding. The thermoplastic resin is cellulose diacetate (A). The sugar ester contains a sugar alkanoic acid ester (B), which is an esterified product of a C2-6 alkanoic acid and at least one sugar selected from the group consisting of monosaccharides, oligosaccharides, and sugar alcohols. The sugar alkanoic acid ester (B) may be sucrose octaacetate. The ratio of the sugar alkanoic acid ester (B) may be 10-65 parts by mass relative to 100 parts by mass of the cellulose diacetate. The resin composition may be a resin composition used for injection molding. The resin composition has excellent melt moldability, transparency, and mechanical properties.
Inventors:
HIROTA MASAYUKI (JP)
MAEDA ASAMI (JP)
MAEDA ASAMI (JP)
Application Number:
PCT/JP2023/004472
Publication Date:
September 07, 2023
Filing Date:
February 10, 2023
Export Citation:
Assignee:
OSAKA GAS CHEMICALS CO LTD (JP)
International Classes:
B29C45/00; C08L1/12; C08L3/16; C09K3/00
Domestic Patent References:
| WO2020175580A1 | 2020-09-03 | |||
| WO2008062610A1 | 2008-05-29 | |||
| WO2009011228A1 | 2009-01-22 |
Foreign References:
| JP2014149325A | 2014-08-21 | |||
| JP2017111189A | 2017-06-22 | |||
| JP2013545905A | 2013-12-26 | |||
| JP2016164669A | 2016-09-08 | |||
| JP2003526694A | 2003-09-09 | |||
| JP2021109942A | 2021-08-02 |
Attorney, Agent or Firm:
SAKANAKA Hiroshi et al. (JP)
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