Title:
RESIN COMPOSITION AND APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/016244
Kind Code:
A1
Abstract:
Provided by the present invention a resin composition and an application thereof, the resin composition comprises the following components: (A) a thermosetting resin, the thermosetting resin comprising a combination of at least two among a thermosetting polyphenylene ether, a polyfunctional vinyl aromatic polymer, a thermosetting hydrocarbon resin, and an auxiliary crosslinking agent containing at least two unsaturated functional groups; and (B) silicon dioxide, the silicon dioxide being prepared by means of organosilicon hydrolysis, the purity of the silicon dioxide being ≥99.9%, the average particle size being 0.1-3 μm, and the diameter distance being <1; the mass percentage of the silicon dioxide in the resin composition is 20-70%. The described resin composition has a low dielectric constant and low dielectric loss, and the rate of change of the dielectric loss after moisture absorption is also low, the water absorption rate is low, and thermal stability is high; a prepreg prepared by the described resin composition can fully meet the performance requirements of a high-frequency, high-speed copper foil substrate.
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Inventors:
LUO CHENG (CN)
CHAI SONGGANG (CN)
YAN SHANYIN (CN)
CHAI SONGGANG (CN)
YAN SHANYIN (CN)
Application Number:
PCT/CN2022/107877
Publication Date:
February 16, 2023
Filing Date:
July 26, 2022
Export Citation:
Assignee:
SHENGYI TECHNOLOGY CO LTD (CN)
International Classes:
C08L25/08; B32B15/20; B32B17/04; B32B27/04; C08J5/18; C08K7/18; C08L53/02; C08L57/02; C08L71/12
Domestic Patent References:
| WO2021024924A1 | 2021-02-11 |
Foreign References:
| CN113527818A | 2021-10-22 | |||
| CN110408332A | 2019-11-05 | |||
| CN104271671A | 2015-01-07 | |||
| US20210108076A1 | 2021-04-15 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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