RESIN COMPOSITION FOR BONDED MAGNETS AND BONDED MAGNETS USING SAME

Title:

RESIN COMPOSITION FOR BONDED MAGNETS AND BONDED MAGNETS USING SAME

Document Type and Number:

WIPO Patent Application WO/2023/120184

Kind Code:

A1

Abstract:

One aspect of the present disclosure can provide a resin composition for bonded magnets, which exhibits excellent physical properties such as heat resistance, thermal shock resistance, bending strength and IZOD impact strength without being deteriorated in magnetic properties.　This resin composition for bonded magnets comprises at least a magnetic powder, a PPS resin and a thermoplastic vinylidene fluoride-based resin, in which the Mooney viscosity of the thermoplastic vinylidene fluoride-based resin at 121°C is 50 or more.

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Inventors:

SAKURAI HIROMITSU (JP)
HINO MAKOTO (JP)
SHIMOHATA YUSUKE (JP)

Application Number:

PCT/JP2022/045062

Publication Date:

June 29, 2023

Filing Date:

December 07, 2022

Export Citation:

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Assignee:

TODA KOGYO CORP (JP)

International Classes:

H01F1/113; H01F1/053

Domestic Patent References:

WO2012053505A1

2012-04-26

Foreign References:

JPH09219312A	1997-08-19
JP2016074872A	2016-05-12
JPH09219310A	1997-08-19

Attorney, Agent or Firm:

OKUMACHI Tetsuyuki (JP)

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