Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/120185
Kind Code:
A1
Abstract:
This semiconductor device comprises a conductive member, a semiconductor element, and a sealing resin. The conductive member has a main surface and a back surface that face opposite sides from each other in the thickness direction. The semiconductor element is grafted to the main surface. The sealing resin covers the conductive member and the semiconductor element. When viewed in the thickness direction, the main surface is surrounded by the back surface. The conductive member has a first end face that is located between the main surface and the back surface in the thickness direction. The first end face is inclined with respect to the back surface. When viewed in the thickness direction, the first end face overlaps the back surface.
Inventors:
MOCHIZUKI YO (JP)
Application Number:
PCT/JP2022/045063
Publication Date:
June 29, 2023
Filing Date:
December 07, 2022
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/36; H01L25/18
Domestic Patent References:
| WO2017188254A1 | 2017-11-02 | |||
| WO2017200004A1 | 2017-11-23 | |||
| WO2016125635A1 | 2016-08-11 |
Foreign References:
| JP2017108002A | 2017-06-15 | |||
| JP2014179541A | 2014-09-25 |
Attorney, Agent or Firm:
USUI Takashi et al. (JP)
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