Title:
RESIN COMPOSITION CONTAINING CURABLE HIGH-MOLECULAR-WEIGHT COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/013128
Kind Code:
A1
Abstract:
Provided is a composition that becomes cured objects which have flexibility enough to be films and which have high adhesiveness to low-roughness copper foils, are low in permittivity and dielectric dissipation factor, and have a high glass transition temperature. The composition is a resin composition comprising: a high-molecular-weight compound represented by formula (1) (wherein R1 and R2 each independently represent a hydrogen atom or a methyl group and m and n, each indicating the average number of repeating units, are each independently in the range of 1 to 2,000); a styrene/butadiene copolymer or a product of hydrogenation of a styrene/butadiene copolymer; and a free-radical initiator.
Inventors:
AKATSUKA YASUMASA (JP)
HAYASHIMOTO SHIGEO (JP)
HAYASHIMOTO SHIGEO (JP)
Application Number:
PCT/JP2022/009328
Publication Date:
February 09, 2023
Filing Date:
March 04, 2022
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08F20/16; C08F290/12; C09J11/06; C09J125/10; C09J125/14
Domestic Patent References:
| WO2020240993A1 | 2020-12-03 |
Foreign References:
| JP2008031199A | 2008-02-14 | |||
| JP2007538381A | 2007-12-27 | |||
| JP2021063182A | 2021-04-22 | |||
| US20190091673A1 | 2019-03-28 | |||
| JP2014024999A | 2014-02-06 |
Other References:
GAWDZIK BARBARA, MACIEJEWSKA MA?GORZATA: "Emulsion polymerization of divinyl monomers stabilized by sodium dodecyl sulfate and bis(2-ethylhexyl)sulfosuccinate sodium salt", JOURNAL OF POLYMER SCIENCE PART A: POLYMER CHEMISTRY, JOHN WILEY & SONS, INC., US, vol. 40, no. 22, 15 November 2002 (2002-11-15), US , pages 3967 - 3973, XP093031574, ISSN: 0887-624X, DOI: 10.1002/pola.10485
Attorney, Agent or Firm:
KAMIMURA Yoichiro (JP)
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