Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/224053
Kind Code:
A1
Abstract:
Provided are a resin composition that exhibits excellent adhesive strength when used as an adhesive, and a cured product using the same. Also provided are a laminate using the cured product, and a method for producing a laminate. The resin composition is characterized by containing 1,1-dicyanoethylene (A), a polymerizable monomer (B) represented by general formula (I), and a polymerizable monomer (C) represented by general formula (II). CH2 = CR1R2 (I) CHR6 = CR7R8 (II)
Inventors:
INATOMI ATSUSHI (JP)
HOSOKI TOMOYA (JP)
NAKAHARA ATSUHIRO (JP)
HOSOKI TOMOYA (JP)
NAKAHARA ATSUHIRO (JP)
Application Number:
PCT/JP2023/018355
Publication Date:
November 23, 2023
Filing Date:
May 16, 2023
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
C08F222/30; C08F2/40
Foreign References:
| JPH01103614A | 1989-04-20 | |||
| JP2019512567A | 2019-05-16 | |||
| JPS489466B1 | ||||
| JPS5272734A | 1977-06-17 | |||
| JPS63277218A | 1988-11-15 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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