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Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND METHOD FOR PRODUCING LAMINATE
Document Type and Number:
WIPO Patent Application WO/2023/224054
Kind Code:
A1
Abstract:
Provided are a resin composition from which an adhesive having excellent heat resistance and moisture resistance can be obtained, and a cured product using the same. Also provided are a laminate using the cured product, and a method for producing a laminate.　The resin composition contains 1,1-dicyanoethylene (A) and a polymerizable monomer (B) represented by general formula (I), and is characterized in that the content of 1,1-dicyanoethylene (A) is 2.0-99.9 mass % of the total of 1,1-dicyanoethylene (A) and the polymerizable monomer (B).　CHR1 = CR2R3 (I)

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Inventors:
INATOMI ATSUSHI (JP)
NAKAHARA ATSUHIRO (JP)
Application Number:
PCT/JP2023/018356
Publication Date:
November 23, 2023
Filing Date:
May 16, 2023
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08F222/30; C08F2/40
Foreign References:
JP2021059620A2021-04-15
US4199359A1980-04-22
JPS63277218A1988-11-15
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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