Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048603
Kind Code:
A1
Abstract:
Provided are: a resin composition comprising a polyimide precursor containing a repeating unit represented by formula (2); a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device, and a semi-conductor device. In formula (2), A1 and A2 each independently represent -O- or -NH-, R111 and R115 represent an organic group, R113 and R114 each independently represent H or an organic group, at least one of R113 and R114 satisfying at least one of the following conditions 1 to 3. 1: contain at least one quaternary carbon atom; 2: contain at least 2 tertiary carbon atoms; 3: contain at least one tertiary carbon atom and at least one polymerizable group.
Inventors:
NOZAKI ATSUYASU (JP)
OOTA KAZUYA (JP)
OOTA KAZUYA (JP)
Application Number:
PCT/JP2023/031309
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; B32B15/088; C08G73/12; C08L79/08; G03F7/004; G03F7/038; G03F7/075; G03F7/20; H01L21/312
Domestic Patent References:
| WO2022145356A1 | 2022-07-07 | |||
| WO2013168675A1 | 2013-11-14 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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