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Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048604
Kind Code:
A1
Abstract:
A resin composition containing a polyimide precursor that includes a repeating unit represented by formula (1-1) and that has a polymerizable group content of 2 mmol/g or more and an amide bond content of 1.5 mmol/ g or less, a polymerization initiator and a polymerizable compound; a cured product; a laminate; a method for producing a cured product; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device.

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Inventors:
NOZAKI ATSUYASU (JP)
SAKITA KYOHEI (JP)
Application Number:
PCT/JP2023/031310
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; B32B15/088; C08G73/12; C08L79/08; G03F7/004; G03F7/037; G03F7/038; G03F7/075; G03F7/20; H01L21/312
Foreign References:
JPH0990632A1997-04-04
JP2018165819A2018-10-25
JP2020024374A2020-02-13
JPH09329893A1997-12-22
Attorney, Agent or Firm:
SIKS & CO. (JP)
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