Title:
RESIN COMPOSITION, CURED PRODUCT, LAMINATED BODY, CURED PRODUCT MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND POLYIMIDE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2022/210466
Kind Code:
A1
Abstract:
Provided are: a resin composition comprising a polyimide precursor containing a repeating unit represented by formula (1); a cured product obtained by curing the resin composition; a laminated body comprising the cured product; a method for manufacturing the cured product; a semiconductor device comprising the cured product or the laminated body; and a polyimide precursor comprising a repeating unit represented by formula (1). In formula (1), A1 and A2 each independently represent an oxygen atom or -NH-, R111 represents a bivalent organic group, Y1, W1, and Y2 each independently represent an aryl group, n represents an integer of 1 or greater, and R113 and R114 each independently represent a hydrogen atom or a monovalent organic group.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2022/014801
Publication Date:
October 06, 2022
Filing Date:
March 28, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G73/10; B32B15/08; B32B27/34; C08F290/14; G03F7/004; G03F7/027; G03F7/095; G03F7/40
Domestic Patent References:
| WO2021020463A1 | 2021-02-04 | |||
| WO2020080206A1 | 2020-04-23 |
Foreign References:
| CN110204717A | 2019-09-06 | |||
| JPH03171033A | 1991-07-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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