Title:
RESIN COMPOSITION, CURED PRODUCT, LAYERED BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAYERED BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/048605
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition comprising a polyimide precursor having a radical-polymerizable group, a photopolymerization initiator, and a compound having a coumarin skeleton; a cured product; a layered body; a method for producing a cured product; a method for producing a layered body; a method for producing a semiconductor device; and a semiconductor device.
Inventors:
YAMAKAWA YUTA (JP)
Application Number:
PCT/JP2023/031311
Publication Date:
March 07, 2024
Filing Date:
August 29, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/027; B32B15/088; C08F290/14; C08K5/1545; C08K5/21; C08K5/32; C08K5/56; C08L79/08; G03F7/004; G03F7/038; G03F7/20; H01L21/312
Domestic Patent References:
| WO2021246458A1 | 2021-12-09 |
Foreign References:
| JP2006058324A | 2006-03-02 | |||
| JP2020024374A | 2020-02-13 | |||
| JP2021120703A | 2021-08-19 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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